Linear bisphenol A phenolic and its epoxy resin production line in line with national environmental protection requirements

Drying equipment

China Reuters drying wire over the years, the mainstream of manufacture of a curing agent for epoxy laminate dicyandiamide, phenol novolac, the advantage of good flexibility and blocking resistance, thermal resistance and resistance to disadvantage ion mobility Poor, the low glass transition temperature of the resulting printed circuit board cannot meet the lead-free soldering requirements. With the implementation of the Waste Electrical and Electronic Equipment (WEEE) Directive of the European Union and the restriction of the use of certain hazardous substances (RoHS) directives in electronic and electrical equipment, the global electronics industry has gradually entered the era of lead-free soldering, rapidly stimulating the demand for related materials and raising lead-free. , Halogen-free proportion, adjust the product structure becomes the top priority for the CCL industry to adapt to the market.

The linear bisphenol A phenolic resin production line that can meet the demand for lead-free soldering in the electronics industry was formally put into production last week at Jiangyin Dongpeng International Technology Trade Co., Ltd. The products were tested by the Hunan Provincial Basic Organic Raw Materials Product Quality Supervision and Inspection Station, and the relative molecular mass distribution was narrow. The free bisphenol A content and other technical indicators were all comparable or superior to those of similar foreign products. This product can realize the lead-free welding of electronic components through a simple process, prompting the entire product to meet the EU environmental protection requirements.

At present, the production capacity of the production line is 1,500 to 2,000 tons/year, and the second phase will reach an annual output of more than 10,000 tons. The production line does not increase new sources of pollution when producing linear bisphenol A phenolic resins and high-purity bisphenol A novolac epoxy resins, and is tested by the environmental protection department to meet the requirements of national environmental protection.

Linear bisphenol A phenolic and its epoxy resin are widely used in the manufacture of copper-clad laminates and other electronic materials, electrical and composite materials modification and other fields. The linear bisphenol A phenolic resin as a curing agent for the epoxy resin can fundamentally improve the heat resistance of the board. According to reports, multi-functional bisphenol A novolac epoxy resin combines the properties of phenolic and epoxy, high cross-linking density after curing, high glass transition temperature of the product, and various properties are improved accordingly. At the same time, high epoxy functionalities also make the cured product exhibit excellent mechanical strength, electrical insulation properties, water resistance, chemical resistance and thermal stability. In addition, linear bisphenol A phenolic and its epoxy resin can also be used as modified materials, and other curing agents and epoxy resin, respectively, for the need to improve the properties of cured products, especially heat-resistant applications.

Linear bisphenol A phenolic resin synthesized from bisphenol A substituted phenol as a raw material, which can be used as a curing agent can well overcome the deficiencies of dicyandiamide and linear phenolic phenolic resin, so as to meet the development of epoxy copper clad laminate technology The high performance, especially the high heat resistance, is a very promising epoxy curing agent.

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