New Generation Sensor Interface Specification I3C Debuts at MEMS Industry Summit
A new generation of sensor interface specifications I3C debuted at the MEMS Industry Summit MobileIndustryProcessorInterfaceAlliance recently announced a new generation of MEMS sensors at the MEMS Industry Summit in Scottsdale, Arizona. Interface specification I3C between other sensor and sensor hubs or processors; the new standard is an extension of the previous generation I2C interface. MIPI's newly released MEMS sensor interface specification I3C (SenseWire) architecture I3C retains a simple two-wire interface and is backward compatible with I2C; provides a minimum data rate of 10 Mbit/s, and Upwards; the new interface supports in-band interrupts, which can reduce component pin counts and signal paths, resulting in more efficient power consumption, support for multi-master, dynamic addressing, and script compatibility ( Command-codecompatibility), as well as advanced power management features, including sleep mode.
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Ken Foust, chairman of the MIPI Association Sensors Working Group, said: "I3C has established a superset of functions on the I2C specification and supports an additional high data rate (HDR) mode that is comparable to the SPI interface technology; the old I2C The interface sensor can be connected to the I3C bus, but to take full advantage of the I3C feature set, both the sensor and host controller hardware needs to be updated.â€
The I3C interface is not only available for mobile devices (this interface will be referred to as SenseWire in this area), but it can also be used in various embedded systems to provide higher speed and higher energy efficiency; the new interface specification can support the current Various sensors used in all devices. Today, the smart phone may contain more than ten kinds of sensors, which has challenged the limits of I2C and SPI. The development of I3C brings to the industry a single interface technology that can support various types of sensors.
The MIPI Association's Sensor Working Group has received support from many members of the Association in the development of new specifications; these include mobile phone, tablet device and notebook computer makers, brand manufacturers, semiconductor suppliers, and application processor developers. , software vendors, IP tool vendors, and test equipment companies.
Foust pointed out that I3C combines the advantages of I2C (two-wire, simple) and SPI (low-power, high-speed) and adds new features, including support for in-band interrupts, dynamic addressing, and more advanced power supplies. Management, while also backward compatible with I2C interface sensors: “Systems with multiple sensors that use the I3C interface will significantly reduce costs and power consumption; these systems will also be more scalable than I2C or SPI interface system."
The MIPI Association also cooperated with the MEMS Industry Group (MIG) and conducted investigations on the member manufacturers of both parties to meet the expectations of all members of the new standard. These members include AMD, AMD, Audience, Broadcom, Cadence, Intel, and InvenSense. , Lattice Semiconductor, MediaTek, Mentor Graphics, Nvidia, NXP, STMicroelectronics, Synopsys, Qualcomm, QuickLogic, VLSIPlus Ltd., ZMDI, and others. .
Foust described the I3C interface as an "evolution" rather than an innovation. It combines the advantages of I2C and SPI. The goal is to expand market penetration; the new interface can meet the market's lower power requirements for sensor interfaces. With fewer components and longer battery life requirements, the design also noted the ease of changing the architecture during future technology upgrades. 
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